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1800 mhz to 2700 mhz, 1 w rf driver amplifier adl5606 rev. 0 information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062-9106, u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ?2011 analog devices, inc. all rights reserved. features operation from 1800 mhz to 2700 mhz gain of 24.3 db at 2140 mhz oip3 of 45.5 dbm at 2140 mhz p1db of 30.8 dbm at 2140 mhz noise figure of 4.7 db at 2140 mhz power supply: 5 v power supply current: 362 ma typical internal active biasing fast power-up/power-down function compact 4 mm 4 mm, 16-lead lfcsp esd rating of 1 kv (class 1c) pin-compatible with the adl5605 (700 mhz to 1000 mhz) applications wireless infrastructure automated test equipment ism/amr applications general description the adl5606 is a broadband, two-stage, 1 w rf driver amplifier that operates over a frequency range of 1800 mhz to 2700 mhz. the device can be used in a wide variety of wired and wireless applications, including ism, mc-gsm, w-cdma, td-scdma, and lte. the adl5606 operates on a 5 v supply voltage and a supply current of 362 ma. the driver also incorporates a fast power- up/power-down function for tdd applications, applications that require a power saving mode, and applications that intermittently transmit data. the adl5606 is fabricated on a gaas hbt process and is packaged in a compact 4 mm 4 mm, 16-lead lfcsp that uses an exposed paddle for excellent thermal impedance. the adl5606 operates from ?40c to +85c. a fully populated evaluation board tuned to 2140 mhz is also available. functional block diagram 09968-001 11 rfout 12 rfout 10 rfout 9rfout 5 n c 6 n c 7 n c 8 n c 1 rfin 2 disable 3 vcc 4 vbias 1 5 n c 1 6 n c 1 4 n c 1 3 n c adl5606 vbias pwdn figure 1. 0 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 0 2 4 6 8 10121416182022 acpr (dbc) p out (dbm) 09968-002 2140 mhz figure 2. acpr vs. output power, 3gpp, tm1-64, at 2140 mhz
adl5606 rev. 0 | page 2 of 20 table of contents features .............................................................................................. 1 ? applications ....................................................................................... 1 ? general description ......................................................................... 1 ? functional block diagram .............................................................. 1 ? revision history ............................................................................... 2 ? specifications ..................................................................................... 3 ? typical scattering parameters ..................................................... 4 ? absolute maximum ratings ............................................................ 6 ? thermal resistance ...................................................................... 6 ? esd caution .................................................................................. 6 ? pin configuration and function descriptions ............................. 7 ? typical performance characteristics ............................................. 8 ? 1960 mhz frequency tuning band ........................................... 8 ? 2140 mhz frequency tuning band ............................................9 ? 2630 mhz frequency tuning band ......................................... 10 ? general......................................................................................... 11 ? applications information .............................................................. 13 ? basic layout connections ......................................................... 13 ? adl5606 matching .................................................................... 14 ? acpr and evm ......................................................................... 15 ? thermal considerations ............................................................ 15 ? soldering information and recommended pcb land pattern .......................................................................................... 15 ? evaluation board ............................................................................ 16 ? outline dimensions ....................................................................... 18 ? ordering guide .......................................................................... 18 revision history 7/11revision 0: initial version
adl5606 rev. 0 | page 3 of 20 specifications vcc1 = 5 v and t a = 25c, unless otherwise noted. 1 table 1. parameter test conditions/comments min typ max unit overall function frequency range 1800 2700 mhz frequency = 1960 mhz 30 mhz gain 24.7 db vs. frequency 30 mhz 0.5 db vs. temperature ?40c t a +85c 0.9 db vs. supply 4.75 v to 5.25 v 0.05 db output 1 db compression point (p1db) 30.2 dbm vs. frequency 30 mhz +0.2/?0.6 db vs. temperature ?40c t a +85c 0.5 db vs. supply 4.75 v to 5.25 v 0.5 db adjacent channel power ratio (acpr) p out = 18 dbm, one-carrier w-cdma, 64 dpch 52 dbc output third-order intercept (oip3) ?f = 1 mhz, p out = 14 dbm per tone 45.6 dbm vs. frequency 30 mhz +0.8/?0.2 db vs. temperature ?40c t a +85c +0.0/?2.2 db vs. supply 4.75 v to 5.25 v 0.5 db noise figure 5.1 db frequency = 2140 mhz 30 mhz gain 24.3 db vs. frequency 30 mhz +0.4/?0.1 db vs. temperature ?40c t a +85c 0.9 db vs. supply 4.75 v to 5.25 v 0.06 db output 1 db compression point (p1db) 30.8 dbm vs. frequency 30 mhz 0.5 db vs. temperature ?40c t a +85c 0.8 db vs. supply 4.75 v to 5.25 v 0.4 db adjacent channel power ratio (acpr) p out = 18 dbm, one-carrier w-cdma, 64 dpch 51 dbc output third-order intercept (oip3) ?f = 1 mhz, p out = 14 dbm per tone 45.5 dbm vs. frequency 30 mhz +2.3/?0.8 db vs. temperature ?40c t a +85c +0.0/?2.5 db vs. supply 4.75 v to 5.25 v +0.6/?0.3 db noise figure 4.7 db frequency = 2630 mhz 60 mhz gain 20.6 db vs. frequency 60 mhz +0.7/?1.8 db vs. temperature ?40c t a +85c 1.0 db vs. supply 4.75 v to 5.25 v 0.09 db output 1 db compression point (p1db) 28.9 dbm vs. frequency 60 mhz +0.5/?1.7 db vs. temperature ?40c t a +85c +1.2/?2.0 db vs. supply 4.75 v to 5.25 v 0.2 db output third-order intercept (oip3) ?f = 1 mhz, p out = 14 dbm per tone 43.2 dbm vs. frequency 60 mhz 3.0 db vs. temperature ?40c t a +85c +0.3/?4.0 db vs. supply 4.75 v to 5.25 v 1.9 db noise figure 5.1 db
adl5606 rev. 0 | page 4 of 20 parameter test conditions/comments min typ max unit power-down interface disable pin logic level to enable v disable decreasing 0 1.1 v logic level to disable v disable increasing 1.4 5 v disable pin current v disable = 5 v 1.4 ma vcc1 pin current 1 v disable = 5 v 4.2 ma enable time 10% of control pulse to 90% of rfout 75 ns disable time 10% of control pulse to 90% of rfout 20 ns power interface rfout pin supply voltage 4.75 5 5.25 v supply current 362 390 ma vs. temperature ?40c t a +85c +0/?25 ma 1 vcc1 is the supply to the dut through the rfout pins. typical scattering parameters vcc1 = 5 v and t a = 25 c; the effects of the test fixture have been de-embedded up to the pins of the device. 1 table 2. frequency (mhz) s11 s21 s12 s22 magnitude (db) angle () magnitude (db) angle () magnitude (db) angle () magnitude (db) angle () 1000 ?5.94 1.63 25.77 42.78 ?64.90 91.56 ?1.68 179.86 1050 ?7.09 ?24.39 25.28 25.40 ?63.13 114.08 ?1.63 179.29 1100 ?7.74 ?48.66 24.68 10.90 ?58.63 108.53 ?1.54 178.87 1150 ?7.94 ?69.86 23.97 ?1.40 ?58.57 98.35 ?1.53 178.32 1200 ?7.82 ?87.28 23.32 ?12.01 ?59.58 114.37 ?1.53 177.95 1250 ?7.46 ?100.72 22.71 ?21.44 ?55.02 106.02 ?1.46 177.27 1300 ?7.06 ?111.67 22.14 ?29.87 ?52.50 102.74 ?1.45 176.60 1350 ?6.70 ?120.51 21.64 ?37.10 ?54.05 91.45 ?1.43 176.34 1400 ?6.38 ?126.95 21.16 ?44.03 ?53.01 111.40 ?1.39 175.90 1450 ?6.08 ?133.47 20.75 ?50.61 ?51.79 83.98 ?1.35 175.36 1500 ?5.76 ?138.12 20.33 ?56.84 ?53.89 111.28 ?1.38 174.93 1550 ?5.47 ?142.70 19.98 ?62.62 ?53.41 117.99 ?1.35 174.51 1600 ?5.24 ?146.61 19.67 ?68.33 ?53.37 76.10 ?1.34 174.16 1650 ?5.02 ?150.10 19.36 ?73.72 ?51.35 87.47 ?1.30 173.84 1700 ?4.76 ?153.11 19.07 ?79.01 ?50.65 92.39 ?1.26 173.35 1750 ?4.58 ?155.89 18.79 ?83.92 ?50.70 83.18 ?1.24 173.01 1800 ?4.42 ?158.41 18.52 ?88.97 ?51.02 92.52 ?1.23 172.59 1850 ?4.25 ?160.75 18.28 ?93.94 ?50.59 93.13 ?1.23 172.28 1900 ?4.11 ?162.84 18.01 ?98.66 ?50.81 82.49 ?1.21 171.75 1950 ?3.97 ?164.79 17.78 ?103.29 ?50.52 90.57 ?1.18 171.61 2000 ?3.82 ?166.56 17.56 ?107.86 ?52.43 75.32 ?1.19 171.19 2050 ?3.72 ?168.58 17.34 ?112.42 ?49.77 80.61 ?1.17 170.99 2100 ?3.61 ?170.35 17.13 ?116.91 ?50.35 81.31 ?1.16 170.70 2150 ?3.50 ?172.01 16.90 ?121.14 ?49.72 83.35 ?1.16 170.44 2200 ?3.42 ?173.71 16.68 ?125.59 ?50.21 87.74 ?1.16 170.09 2250 ?3.36 ?175.63 16.47 ?129.80 ?47.59 82.95 ?1.17 169.84 2300 ?3.28 ?177.44 16.27 ?134.15 ?47.62 88.25 ?1.14 169.46 2350 ?3.23 ?179.05 16.02 ?138.14 ?48.93 79.29 ?1.16 169.27 2400 ?3.23 179.33 15.79 ?142.35 ?49.37 83.50 ?1.18 169.01 2450 ?3.19 177.86 15.58 ?146.40 ?48.09 75.23 ?1.18 168.72 2500 ?3.15 176.27 15.37 ?150.40 ?47.72 78.72 ?1.16 168.34 2550 ?3.17 174.60 15.15 ?154.46 ?47.40 76.72 ?1.18 168.15
adl5606 rev. 0 | page 5 of 20 frequency (mhz) s11 s21 s12 s22 magnitude (db) angle () magnitude (db) angle () magnitude (db) angle () magnitude (db) angle () 2600 ?3.14 172.86 14.92 ?158.40 ?46.51 77.12 ?1.20 167.77 2650 ?3.14 171.24 14.70 ?162.27 ?47.66 73.90 ?1.20 167.47 2700 ?3.12 169.74 14.48 ?166.06 ?47.77 71.80 ?1.22 167.16 2750 ?3.14 167.93 14.24 ?169.97 ?45.35 73.70 ?1.22 166.68 2800 ?3.16 166.21 13.98 ?173.76 ?45.43 76.05 ?1.24 166.34 2850 ?3.15 164.65 13.78 ?177.32 ?46.35 71.78 ?1.25 166.25 2900 ?3.15 162.67 13.53 178.93 ?46.92 73.31 ?1.26 165.90 2950 ?3.15 160.86 13.27 175.30 ?45.88 70.64 ?1.30 165.58 3000 ?3.14 159.03 13.04 171.76 ?45.94 66.79 ?1.29 165.35 3050 ?3.13 157.22 12.79 168.32 ?45.60 73.37 ?1.33 165.06 3100 ?3.08 155.39 12.57 165.01 ?44.06 61.32 ?1.35 164.76 3150 ?3.01 152.90 12.32 161.32 ?45.54 58.34 ?1.36 164.32 3200 ?3.08 150.72 12.04 157.39 ?46.51 60.72 ?1.36 163.65 3250 ?3.06 149.25 11.78 153.80 ?43.87 61.02 ?1.35 163.38 3300 ?3.05 147.28 11.53 150.59 ?44.31 68.64 ?1.36 162.94 3350 ?3.03 145.53 11.20 147.57 ?44.17 62.82 ?1.39 162.61 3400 ?2.94 143.76 10.95 144.00 ?43.67 64.76 ?1.39 162.08 3450 ?2.95 141.94 10.65 141.12 ?44.65 72.58 ?1.39 161.92 3500 ?2.85 140.04 10.39 137.78 ?44.52 53.43 ?1.38 161.39 3550 ?2.83 138.58 10.10 134.68 ?44.22 63.44 ?1.35 161.11 3600 ?2.79 136.47 9.83 131.38 ?43.79 46.56 ?1.36 160.74 3650 ?2.74 134.67 9.55 128.32 ?42.04 50.76 ?1.31 160.48 3700 ?2.78 132.80 9.25 125.07 ?43.97 57.92 ?1.33 160.24 3750 ?2.80 130.85 8.94 121.74 ?42.96 49.24 ?1.30 159.79 3800 ?2.87 128.85 8.63 119.06 ?43.01 51.05 ?1.30 159.68 3850 ?3.03 126.98 8.30 115.71 ?41.84 45.82 ?1.24 159.28 3900 ?3.24 125.26 7.90 113.11 ?41.50 36.66 ?1.26 159.17 3950 ?3.63 123.34 7.59 110.08 ?42.15 39.82 ?1.20 159.15 4000 ?4.24 122.71 7.15 108.11 ?41.81 41.17 ?1.21 159.19 1 vcc1 is the supply to the dut through the rfout pins.
adl5606 rev. 0 | page 6 of 20 absolute maximum ratings table 3. parameter rating supply voltage, vcc1 1 6.5 v input power (50 impedance) 18 dbm internal power dissipation (paddle soldered) 3.5 w maximum junction temperature 150c lead temperature (soldering 60 sec) 240c operating temperature range ?40c to +85c storage temperature range ?65c to +150c 1 vcc1 is the supply to the dut through the rfout pins. stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. thermal resistance table 4 lists the junction-to-air thermal resistance ( ja ) and the junction-to-paddle thermal resistance ( jc ) for the adl5606 . for more information, see the thermal considerations section. table 4. thermal resistance package type ja jc unit 16-lead lfcsp (cp-16-10) 52.9 12.9 c/w esd caution
adl5606 rev. 0 | page 7 of 20 pin configuration and fu nction descriptions pin 1 indicator 1 rfin 2 disable 3 vcc 4 vbias 11 rfout 12 rfout 10 rfout 9rfout 5 n c 6 n c 7 n c 8 n c 1 5 n c 1 6 n c 1 4 n c 1 3 n c adl5606 top view (not to scale) 09968-003 notes 1. the exposed paddle should be soldered to a low impedance electrical and thermal ground plane. 2. nc = no connect. do not connect to this pin. figure 3. pin configuration table 5. pin function descriptions pin o. mnemonic description 1 rfin rf input. requires a dc blocking capacitor. 2 disable connect this pin to 5 v to disable the part. in the disabled state, the part draws approximately 4 ma of current from the power supply and 1.4 ma from the disable pin. 3 vcc under normal operation, this pin is connected to the power supply and draws a combined 362 ma of current. when this pin is grounded along with the vbias pin, the device is disabled and draws approximately 1.4 ma from the disable pin. 4 vbias applying 5 v to this pin enables the bias circui t. when this pin is grounded, the device is disabled. 5, 6, 7, 8, 13, 14, 15, 16 nc no connect. do not connect to this pin. 9, 10, 11, 12 rfout rf output. dc bias is provided to this pin through an inductor that is connected to the 5 v power supply. the rf path requires a dc blocking capacitor. ep the exposed paddle should be so ldered to a low impedance electr ical and thermal ground plane.
adl5606 rev. 0 | page 8 of 20 typical performance characteristics 1960 mhz frequency tuning band 50 0 1930 1990 noise figure, gain, p1db, oip3 (db, dbm) frequency (mhz) 09968-004 5 10 15 20 25 30 35 40 45 1940 1950 1960 1970 1980 oip3 (dbm) p1db (dbm) gain (db) nf (db) figure 4. noise figure, gain, p1db, and oip3 vs. frequency (oip3 at p out = 14 dbm per tone) ?40c 26.5 26.0 22.5 23.0 23.5 24.0 24.5 25.0 25.5 1930 1940 1950 1960 1970 1980 1990 gain (db) frequency (mhz) 09968-005 +25c +85c figure 5. gain vs. fr equency and temperature 0 ?60 1930 1990 s-parameters (db) frequency (mhz) 09968-006 ?40 ?50 ?30 ?20 ?10 1940 1950 1960 1970 1980 s11 s12 s22 figure 6. input return loss (s11), output return loss (s22), and reverse isolation (s12) vs. frequency ?40c ?40c 46 26 1930 1940 1950 1960 1970 1980 1990 p1db (dbm) oip3 (dbm) frequency (mhz) 09968-007 +25c +85c +85c 30 32 34 36 38 40 42 44 46 48 50 28 30 32 34 36 38 40 42 44 +25c figure 7. p1db and oip3 vs. frequency and temperature (oip3 at p out = 14 dbm per tone) 1930mhz 1960mhz 1990mhz 48 47 40 41 42 43 44 45 46 ?5 0 5 10 15 20 oip3 (dbm) p out per tone (dbm) 09968-008 figure 8. oip3 vs. p out and frequency 7 3 1930 1990 noise figure (db) frequency (mhz) 09968-009 5 4 6 1940 1950 1960 1970 1980 +85c +25c ?40c figure 9. noise figure vs. frequency and temperature
adl5606 rev. 0 | page 9 of 20 2140 mhz frequency tuning band 60 50 0 2110 2170 noise figure, gain, p1db, oip3 (db, dbm) frequency (mhz) 09968-010 10 20 30 40 2120 2130 2140 2150 2160 oip3 (dbm) p1db (dbm) gain (db) nf (db) figure 10. noise figure, gain, p1db, and oip3 vs. frequency (oip3 at p out = 14 dbm per tone) ?40c 28 27 20 21 22 23 24 25 26 2110 2120 2130 2140 2150 2160 2170 gain (db) frequency (mhz) 09968-011 +25c +85c figure 11. gain vs. frequency and temperature 0 ?10 ?60 2110 2170 s-parameters (db) frequency (mhz) 09968-012 ?50 ?40 ?30 ?20 2120 2130 2140 2150 2160 s11 s12 s22 figure 12. input return loss (s11) , output return loss (s22), and reverse isolation (s12) vs. frequency 46 26 oip3 (dbm) 30 32 34 36 38 40 42 44 46 48 50 28 30 32 34 36 38 40 42 44 2110 2120 2130 2140 2150 2160 2170 p1db (dbm) frequency (mhz) 09968-013 +25c ?40c +85c +25c ?40c +85c figure 13. p1db and oip3 vs . frequency and temperature (oip3 at p out = 14 dbm per tone) 2110mhz 2140mhz 2170mhz 50 48 30 42 40 38 36 34 32 44 46 ?5 0 5 10 15 20 oip3 (dbm) p out per tone (dbm) 09968-014 figure 14. oip3 vs. p out and frequency 7 6 3 2110 2170 noise figure (db) frequency (mhz) 09968-015 4 5 2120 2130 2140 2150 2160 ?40c +25c +85c figure 15. noise figure vs . frequency and temperature
adl5606 rev. 0 | page 10 of 20 2630 mhz frequency tuning band 60 0 2570 2690 noise figure, gain, p1db, oip3 (db, dbm) frequency (mhz) 09968-016 10 20 30 40 50 2590 2610 2630 2650 2670 nf (db) gain (db) p1db (dbm) oip3 (dbm) figure 16. noise figure, gain, p1db, and oip3 vs. frequency (oip3 at p out = 14 dbm per tone) 23.0 17.0 2570 2690 gain (db) frequency (mhz) 09968-017 2590 2610 2630 2650 2670 17.5 18.0 18.5 19.0 19.5 20.0 20.5 21.0 21.5 22.0 22.5 +25c +85c ?40c figure 17. gain vs. frequency and temperature 0 ?60 2570 2690 s-parameters (db) frequency (mhz) 09968-018 2590 2610 2630 2650 2670 ?50 ?40 ?30 ?20 ?10 s11 s12 s22 figure 18. input return loss (s11) , output return loss (s22), and reverse isolation (s12) vs. frequency 22 52 2570 2590 2610 2630 2650 2670 2690 p1db (dbm) oip3 (dbm) frequency (mhz) 09968-019 ?40c +25c +85c 24 27 30 33 36 39 42 45 48 51 54 25 28 31 34 37 40 43 46 49 +85c ?40c +25c figure 19. p1db and oip3 vs . frequency and temperature (oip3 at p out = 14 dbm per tone) 49 47 35 ?5 20 oip3 (dbm) p out per tone (dbm) 09968-020 37 39 41 43 45 051 01 5 2570mhz 2630mhz 2690mhz figure 20. oip3 vs. p out and frequency 7 3 4 2570 2690 noise figure (db) frequency (mhz) 09968-021 2590 2610 2630 2650 2670 5 6 ?40c +25c +85c figure 21. noise figure vs . frequency and temperature
adl5606 rev. 0 | page 11 of 20 general 35 30 25 20 15 10 5 0 43.0 43.5 44.0 44.5 45.0 45.5 46.0 46.5 47.0 47.5 percentage (%) oip3 (dbm) 09968-022 figure 22. oip3 distribution at 2140 mhz, 14 dbm per tone 35 30 25 20 15 10 5 0 29.8 30.0 30.2 30.4 30.6 30.8 31.0 31.2 31.4 31.6 percentage (%) p1db (dbm) 09968-023 figure 23. p1db distribution at 2140 mhz 35 30 25 20 15 10 5 0 23.4 23.6 23.8 24.0 24.2 24.4 24.6 24.8 25.0 percentage (%) gain (db) 09968-024 figure 24. gain distribution at 2140 mhz 30 25 20 15 10 5 0 4.66 4.68 4.70 4.72 4.74 4.76 4.78 4.80 4.82 percentage (%) noise figure (db) 09968-025 figure 25. noise figure distribution at 2140 mhz 0 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 0 2 4 6 8 10121416182022 acpr (dbc) p out (dbm) 09968-026 1960mhz 2140mhz figure 26. acpr vs. p out , 3gpp, tm1-64, at 1960 mhz and 2140 mhz 0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 ?10?5 0 5 10152025 evm (%) p out (dbm) 0 9968-027 1960mhz 2140mhz figure 27. evm vs. p out , 3gpp, tm1-64, at 1960 mhz and 2140 mhz
adl5606 rev. 0 | page 12 of 20 375 340 ?40 ?20 0 20 40 60 80 supply current (ma) temperature (c) 09968-028 345 350 355 360 365 370 5v 4.75v 5.25v figure 28. supply current vs. temperat ure and supply voltage at 2140 mhz 0 9968-029 ch2 1v ? ch3 1v ? m20ns 10gs/s it 4ps/pt a ch2 2.5v 3 2 figure 29. turn-off time, 10% of control pulse to 90% of rfout 0 9968-030 ch2 1v ? ch3 1v ? m20ns 10gs/s it 4ps/pt a ch2 2.5v 3 2 figure 30. turn-on time, 10% of control pulse to 90% of rfout
adl5606 rev. 0 | page 13 of 20 applications information basic layout connections the basic connections for operating the adl5606 are shown in figure 31 . the rf matching components correspond to the 2140 mhz frequency tuning band. power supply the voltage supply for the adl5606 , which ranges from 4.75 v to 5.25 v, should be connected to the vcc1 test pin. the dc bias to the output stage is supplied through l1 and is connected to the rfout pin. three decoupling capacitors (c7, c8, and c9) are used to prevent rf signals from propagating on the dc lines. the vbias and vcc pins can be directly connected to the main supply voltage. additional decoupling capacitors (c5, c6, and c11) are required on the vcc pin. rf input interface pin 1 is the rf input pin for the adl5606 . the rf input is easily matched with one capacitor, in a series or shunt configuration, and a microstrip line used as an inductor. for the 1960 mhz and 2140 mhz frequency tuning bands, a shunt capacitor is used to match the input to 50 ; for the 2630 mhz frequency tuning band, a series capacitor is used. for complete information about component values and spacing for the different frequency tuning bands, see the adl5606 matching section. rf output interface pin 9 to pin 12 are the rf output pins. the rf output requires only one shunt capacitor and a microstrip line used as an inductor to match to 50 . for complete information about component values and spacing for the different frequency tuning bands, see the adl5606 matching section. power-down the adl5606 can be disabled by connecting the disable pin to 5 v. when disabled, the adl5606 draws approximately 4 ma of current from the power supply and 1.4 ma from the disable pin. decoupling capacitor c3 is recommended to prevent the propagation of rf signals. to completely shut down the device, connect the vcc pin, the vbias pin, and the vcc1 test pin to ground. in this state, the part draws approximately 1.4 ma from the disable pin. rfin vcc disable rfout 12 vbias 11 vcc 10 disable 9 rfin 1 2 3 4 adl5606 vcc1 c out 3.9pf c2 20pf c1 20pf c in 1.3pf c3 10pf c5 100pf c7 100pf c8 0.01f c9 10f rfout rfout rfout rfout 09968-031 13 8 14 7 15 6 16 5 nc nc nc nc nc nc nc nc c6 0.01f c11 10f l1 18nh figure 31. basic connections
adl5606 rev. 0 | page 14 of 20 adl5606 matching the rf input and output of the adl5606 can be easily matched to 50 with at most one external component and the micro- strip line used as an inductor. table 6 lists the required matching component values. capacitors c in and c out are murata grm155 series (0402 size). for all frequency tuning bands, the placement of c in and c out is critical. table 7 lists the recommended component spacing for the various frequency tuning bands. the component spacing is referenced from the center of the component to the edge of the package. figure 32 to figure 34 show the matching networks. table 6. recommended components for basic connections frequency (mhz) c in (pf) c out (pf) 1930 to 1990 2.0 3.6 2110 to 2170 1.3 3.9 2570 to 2690 2.0 3.3 table 7. matching component spacing frequency (mhz) 1 (mils) 2 (mils) 1930 to 1990 394 197 2110 to 2170 268 138 2570 to 2690 382 83 rfout 12 11 10 9 rfin 16 1 2 13 14 15 nc nc nc nc rfin rfout rfout rfout rfout disable c in 2pf c out 3.6pf c2 20pf l1 18nh c1 20pf 1 2 adl5606 09968-032 figure 32. adl5606 match parameters, 1960 mh z frequency tuning band rfout 12 11 10 9 rfin 16 1 2 13 14 15 nc nc nc nc rfin rfout rfout rfout rfout disable c in 1.3pf c out 3.9pf c2 20pf l1 18nh c1 20pf 1 2 adl5606 09968-033 figure 33. adl5606 match parameters, 2140 mh z frequency tuning band rfout 12 11 10 9 rfin 16 1 2 13 14 15 nc nc nc nc rfin rfout rfout rfout rfout disable c in 2pf c out 3.3pf c2 20pf l1 18nh c1 20pf 1 2 adl5606 09968-034 figure 34. adl5606 match parameters, 2630 mh z frequency tuning band
adl5606 rev. 0 | page 15 of 20 acpr and evm all adjacent channel power ratio (acpr) and error vector magnitude (evm) measurements were made using a single w-cdma carrier and test model 1-64. the signal is generated by a very low acpr source and is meas- ured at the output by a high dynamic range spectrum analyzer. for acpr measurements, the filter setting was chosen for low acpr; for evm measurements, the low evm setting was selected. the spectrum analyzer incorporates an instrument noise correc- tion function, and highly linear amplifiers were used to boost the power levels for acpr measurements. figure 26 shows acpr vs. p out at 1960 mhz and 2140 mhz. for power levels up to 18 dbm, an acpr of 50 dbc or better can be achieved at 1960 mhz and 2140 mhz. figure 27 shows evm vs. p out at 1960 mhz and 2140 mhz. the evm measured is 0.5% for power levels up to 18 dbm at 1960 mhz and 2140 mhz. the baseline composite evm for the signal source was approximately 0.5%. when operated in the linear region, there is little or no contribution to evm by the amplifier. thermal considerations the adl5606 is packaged in a thermally efficient 4 mm 4 mm, 16-lead lfcsp. the thermal resistance from junction to air ( ja ) is 52.9c/w. the thermal resistance for the product was extracted assuming a standard 4-layer jedec board with 25 copper plated thermal vias. the thermal vias are filled with conductive copper paste (ae3030 with thermal conductivity of 7.8 w/mk and thermal expansion 1 of 4 10 ?5 /c and 2 of 8.6 10 ?5 /c). the thermal resistance from junction to case ( jc ) is 12.9c/w, where the case is the exposed pad of the lead frame package. for the best thermal performance, it is recommended that as many thermal vias as possible be added under the exposed pad of the lfcsp. the thermal resistance values assume a minimum of 25 thermal vias arranged in a 5 5 array with a via diameter of 8 mils, via pad of 16 mils, and a pitch of 20 mils. the vias are plated with copper, and the drill hole is filled with a conductive copper paste. for optimal performance, it is recommended that the thermal vias be filled with a conductive paste of the equivalent thermal conductivity specified earlier in this section; alternatively, an external heat sink can be used to dissipate heat quickly without affecting the die junction temperature. it is also recommended that the ground pattern be extended above and below the device to improve thermal efficiency (see figure 35 ). soldering information and recommended pcb land pattern figure 35 shows the recommended land pattern for the adl5606 . to minimize thermal impedance, the exposed paddle on the 4 mm 4 mm lfcsp is soldered to a ground plane along with pin 5 to pin 8 and pin 13 to pin 16. to improve thermal dissi- pation, 25 thermal vias are arranged in a 5 5 array under the exposed paddle. areas above and below the paddle are tied with regular vias. if multiple ground layers exist, they should be tied together using vias. for more information about land pattern design and layout, see the an-772 application note , a design and manufacturing guide for the lead frame chip scale package (lfcsp) . 09968-035 rfout rfin 16 mil via pad with 8 mil via 16 13 58 figure 35. recommended land pattern
adl5606 rev. 0 | page 16 of 20 evaluation board the schematic of the adl5606 evaluation board is shown in figure 36 . the evaluation board uses 25 mils wide, 50 traces and is made from is410 material with a 20 mils gap to ground. the evaluation board is tuned for operation at 2140 mhz. the inputs and outputs should be ac-coupled with appropriately sized capacitors; therefore, for low frequency applications, the value of c1 and c2 may need to be increased. dc bias is provided to the output stage via an inductor (l1) connected to the rfout pin. a bias voltage of 5 v is recommended. the evaluation board has a short, non-50 line on its output to accommodate the four output pins and to allow for easier low inductance output matching. the pads for pin 9 to pin 12 are included on this microstrip line and are included in all matches. the evaluation board uses numbers as identifiers to aid in the placement of matching components at both the rf input and rf output of the device. figure 37 and figure 38 show images of the board layout. rfin vcc3 vcc2 disable rfout 12 vbias 11 vcc 10 disable 9 rfin 1 2 3 4 adl5606 c out 3.9pf c2 20pf c1 20pf c in 1.3pf c3 10pf c4 open c10 open c5 100pf c7 100pf c8 0.01f c9 10f rfout rfout rfout rfout 09968-036 13 8 14 7 15 6 16 5 nc nc nc nc nc nc nc nc c6 0.01f c11 10f c12 open c13 open c14 open l1 18nh vcc1 r4 open r1 0 ? r5 open r2 0 ? figure 36. evaluation board, 2140 mhz frequency tuning band table 8. evaluation board configuration options, 2140 mhz frequency tuning band component function/otes default value c1, c2 input/output dc blocking capacitors. c1, c2 = 20 pf c3, c4, c5, c6, c7, c8, c9, c10, c11, c12, c13, c14 power supply decoupling capacitors. power supp ly decoupling capacitors are required to filter out the high frequency noise on the power supply. the smallest capacitor should be the closest to the adl5606 . the main bias that goes through rf out is the most sensitive to noise because the bias is connected directly to the rf output. for the 1960 mhz and 2140 mhz frequency tuning bands, capacitors c12, c13, and c14 are open; for the 2630 mhz frequency tuning band, it is recommended that the by passing capacitors be added as follows: c12 = 100 pf, c13 = 0.01 f, and c14 = 10 f. c3 = 10 pf c5, c7 = 100 pf c6, c8 = 0.01 f c9, c11 = 10 f c4, c10, c12, c13, c14 = open c in input matching capacitor. to match the adl5606 at the 2140 mhz frequency tuning band, shunt capacitor c in is required at a distance of 268 mils. if space is at a premium, an inductor can take the place of the microstrip line. c in = 1.3 pf hq c out output matching capacitor. c out is set at a specific distance from the device so that the micro- strip line can act as inductance for the matching network (see table 7 ). if space is at a premium, an inductor can take the place of the microstrip line. a short length of low impedance line on the output is embedded in the match. c out = 3.9 pf hq l1 the main bias for the adl5606 comes through l1 to the output stage. l1 should be high impedance for the frequency of operation while providing low resistance for the dc current. the evaluation board uses a coilcraft? 0603hp-18nx_lu inductor; this 18 nh inductor provides some of the match at 2140 mhz. l1 = 18 nh r1, r2, r4, r5 to provide bias to all stages through just one supply, set r1 and r2 to 0 , and leave r4 and r5 open. to provide separate bias to stages, se t r1 and r2 to open and r4 and r5 to 0 . r1, r2 = 0 r4, r5 = open exposed paddle the paddle should be connected to both thermal and electrical ground.
adl5606 rev. 0 | page 17 of 20 09968-037 figure 37. evaluation board layout, top 09968-038 figure 38. evaluation board layout, bottom
adl5606 rev. 0 | page 18 of 20 outline dimensions 16 5 13 8 9 12 1 4 1.95 bsc pin 1 indicator top view 4.00 bsc sq 3.75 bsc sq coplanarity 0.08 exposed pa d (bottom view) 12 max 1.00 0.85 0.35 0.80 max 0.65 typ 0.05 max 0.02 nom 0.65 bsc 0.60 max 0.60 max pin 1 indicator 0.50 0.40 0.30 0.25 min 2.50 2.35 sq 2.20 compliant to jedec standards mo-220-vggc 0.80 seating plane 0.30 0.25 0.20 ref 082008-a for proper connection of the exposed pad, refer to the pin configuration and function descriptions section of this data sheet. figure 39. 16-lead lead frame chip scale package [lfcsp_vq] 4 mm 4 mm body, very thin quad (cp-16-10) dimensions shown in millimeters ordering guide model 1 temperature range package description package option adl5606acpz-r7 ?40c to +85c 16-lead lead frame chip scale package [lfcsp_vq] cp-16-10 ADL5606-EVALZ evaluation board 1 z = rohs compliant part.
adl5606 rev. 0 | page 19 of 20 notes
adl5606 rev. 0 | page 20 of 20 notes ?2011 analog devices, inc. all rights reserved. trademarks and registered trademarks are the prop erty of their respective owners. d09968-0-7/11(0)

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